Interconnection Research Group

The Interconnection Research Group addresses the challenges in the design, materials science and manufacture of electronics intensive products.  The research is often concerned with process physics – materials interactions and increasingly is tackling problems associated with packaging of functionality and its physical realisation, especially where the physical embodiment of the product directly impacts on its performance.

Current research

• Professor Paul Conway: Electronics manufacturing processes.  Processing of materials.  Design for electronics manufacture.  Process modelling.  MIS for electronics manufacturing facilities.  Micro/nano assembly.  Materials processing.

• Dr David Hutt: Core research is in the area of electronics manufacture, with special emphasis on the manufacturing challenges involved in device miniaturisation and interconnection.  Particular interests include the development of low-cost methods for the formation of microstructures using new technologies.  Current research fields include: Flip-chip assembly, Advanced printed circuit board manufacturing and Fluxless soldering.

• Professor Changqing Liu: Surface and interface engineering to enable micro/nano scale electronics interconnection and integration, with an emphasis on multilayer and multiphase materials behaviour and interactions.

• David Whalley: Research topics primarily involve electronic manufacturing process understanding, control and simulation and design for manufacture and design optimisation of electronic products.  Specific projects have included: Solder joint reliability, Rework of solder joints, Surface mount technology, Electrically conductive adhesives, Anisotropically conductive adhesives, Thermal design and simulation, Microfabrication and assembly, Solder jetting.

  
  

The work of the Group is further supported by

• Martin Goosey, Visiting Professor
• Johan Liu, Visiting Professor